What are the commonly used processing materials for metal stamping processing
The commonly used stamping materials for metal stamping are as follows:
1. Stainless steel SUS304 is one of the most widely used stainless steels. Because it contains Ni (nickel), it has better corrosion resistance and heat resistance than Cr (chromium) steel. It has very good mechanical properties and no heat treatment hardening. , There is no elasticity.
2. Stainless steel SUS301 has lower Cr (chromium) content than SUS304, and has poor corrosion resistance, but it can obtain good tensile force and hardness after cold working, and has good elasticity. It is mostly used for shrapnel springs and EMI prevention.
3. Ordinary cold-rolled plate SPCC, SPCC refers to the continuous rolling of steel ingots through cold rolling mills into steel coils or sheets of required thickness. There is no protection on the surface of SPCC, and it is easily oxidized when exposed to the air, especially in a humid environment, the oxidation speed is accelerated, and dark red rust appears. The surface should be painted, electroplated or other protection when in use.
4. Galvanized steel sheet SECC, the substrate of SECC is general cold-rolled steel coil, which becomes electro-galvanized product after degreasing, pickling, electroplating and various post-treatment processes on the continuous electro-galvanizing production line. SECC not only has the mechanical properties and similar processability of general cold-rolled steel sheet, but also has superior corrosion resistance and decorative appearance. It is highly competitive and replaceable in the market of electronic products, home appliances and furniture.
5. Hot-dip galvanized steel sheet SGCC, hot-dip galvanized steel coil refers to the semi-finished product after hot-rolled pickling or cold-rolled, washed, annealed, and immersed in a molten zinc tank at a temperature of about 460°C to make the steel sheet It is coated with a zinc layer, then tempered, leveled and chemically treated. SGCC material is harder than SECC material, has poor ductility (avoid deep drawing design), thicker zinc layer, and poor electric weldability.